Thin glass based photonic packaging

PRELEGENT: 
dr Wojciech Lewoczko-Adamczyk
DataSeminarium: 
2023-01-23
AfiliacjaPrelegenta: 
Fraunhofer Institute for Realiability and Microintegration IZM, Berlin, Niemcy
AbstraktSeminarium: 

We propose an intermediate scale hybrid integration of optics and electronics using thin display glass. Such glasses are available in inexpensive large formats typically 600 mm x 600 mm and can be subsequently singularized for holding, embedding and contacting various optical and electro-optical elements, such as light sources, modulators, photo detectors, beam forming and coupling optics and sensing elements. Moreover, optical waveguides can be buried under the glass surface in a process of ion exchange. An example of this generic photonic packaging platform based on thin glass: an optical micro-bench serving as a light source for fiber sensor applications will be presented. We will also draft a vision to use thin glass packaging in future quantum technologies.